US 11,855,357 B2
Multi-band antenna device
Youngki Lee, Suwon-si (KR); Sunwoo Lee, Suncheon-si (KR); and Dooseok Choi, Hwaseong-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Aug. 4, 2022, as Appl. No. 17/881,219.
Application 17/881,219 is a continuation of application No. 17/038,883, filed on Sep. 30, 2020, granted, now 11,437,733.
Claims priority of application No. 10-2020-0039942 (KR), filed on Apr. 1, 2020.
Prior Publication US 2022/0376406 A1, Nov. 24, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H01Q 21/06 (2006.01); H01Q 5/35 (2015.01); H01Q 5/48 (2015.01)
CPC H01Q 21/067 (2013.01) [H01Q 5/35 (2015.01); H01Q 5/48 (2015.01); H01Q 21/062 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An antenna device comprising:
an antenna space including a first antenna configured to transmit/receive a first radio frequency (RF) signal in a first communication band and a second antenna configured to transmit/receive a second RF signal in a second communication band different from the first communication band;
a barrier including a penetration region, the barrier disposed adjacent to the antenna space and reflecting the first RF signal and the second RF signal;
a signal processing device disposed adjacent to the barrier, the signal processing device including a first RF circuit configured to process the first RF signal and a second RF circuit configured to process the second RF signal; and
a feed space comprising a first feed layer and a second feed layer, the feed space being disposed adjacent to and stacked on the signal processing device and adjacent to the barrier,
wherein a first feed line connecting the first RF circuit to the first antenna passes through the first feed layer and the penetration region of the barrier, and a second feed line connecting the second RF circuit to the second antenna passes through the second feed layer and the penetration region of the barrier.