US 11,855,356 B2
Three dimensional antenna array module
Seunghwan Yoon, Irvine, CA (US); Franco De Flaviis, Irvine, CA (US); Alfred Grau Besoli, Irvine, CA (US); Kartik Sridharan, San Diego, CA (US); Ahmadreza Rofougaran, Newport Beach, CA (US); Michael Boers, South Turramurra (AU); Sam Gharavi, Irvine, CA (US); Donghyup Shin, Irvine, CA (US); Farid Shirinfar, Granada Hills, CA (US); Stephen Wu, Fountain Valley, CA (US); and Maryam Rofougaran, Rancho Palos Verdes, CA (US)
Assigned to MOVANDI CORPORATION, Irvine, CA (US)
Filed by Movandi Corporation, Irvine, CA (US)
Filed on Aug. 30, 2022, as Appl. No. 17/898,706.
Application 17/004,373 is a division of application No. 15/607,750, filed on May 30, 2017, granted, now 10,916,861, issued on Feb. 9, 2021.
Application 17/898,706 is a continuation of application No. 17/004,373, filed on Aug. 27, 2020, granted, now 11,509,066.
Prior Publication US 2022/0416442 A1, Dec. 29, 2022
Int. Cl. H01Q 21/00 (2006.01); H01Q 21/06 (2006.01); H01Q 1/22 (2006.01); H01Q 9/04 (2006.01)
CPC H01Q 21/065 (2013.01) [H01Q 1/2283 (2013.01); H01Q 9/045 (2013.01); H01Q 21/0025 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An apparatus, comprising:
a plurality of antenna modules; and
a printed circuit board (PCB) having a plurality of holes embedded with a heat sink,
wherein each antenna module of the plurality of antenna modules comprises:
an antenna substrate;
a plurality of three-dimensional (3-D) antenna cells mounted on a first surface of the antenna substrate; and
a plurality of packaged circuitry mounted on a second surface of the antenna substrate, wherein the plurality of packaged circuitry are electrically connected with the plurality of 3-D antenna cells,
wherein each antenna module of the plurality of antenna modules is mounted within a respective hole of the plurality of holes such that a corresponding packaged circuitry of the plurality of packaged circuitry is in a direct contact with the heat sink.