US 11,855,332 B2
TIC environmental event sensor
Darrel Eugene Self, Kannapolis, NC (US)
Assigned to TSG R&D2, LLC, Davidson, SC (US)
Filed by Darrel Eugene Self, Kannapolis, NC (US)
Filed on Mar. 14, 2022, as Appl. No. 17/694,480.
Application 17/694,480 is a continuation of application No. 17/222,128, filed on Apr. 5, 2021, granted, now 11,274,946.
Application 17/222,128 is a continuation of application No. 16/389,971, filed on Apr. 21, 2019, granted, now 10,969,255, issued on Apr. 6, 2021.
Claims priority of provisional application 62/660,926, filed on Apr. 20, 2018.
Prior Publication US 2022/0276078 A1, Sep. 1, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H01Q 1/22 (2006.01); G01D 9/00 (2006.01); H05K 5/00 (2006.01); H01Q 5/20 (2015.01); G01D 7/00 (2006.01); H04B 1/40 (2015.01)
CPC H01Q 1/2208 (2013.01) [G01D 7/00 (2013.01); G01D 9/005 (2013.01); H01Q 5/20 (2015.01); H04B 1/40 (2013.01); H05K 5/0017 (2013.01); H05K 5/0091 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A network for obtaining and recording weather information over a region, comprising a plurality of micro weather stations distributed over said region, each of said plurality of micro weather stations comprising: an environmental event sensor for sensing, communicating, and displaying environmental information in association with an asset, to capture changes in sensor data in real time, and then log it for future examination, comprising:
a nickel sized ultra-thin circuit assembly having a microprocessor, a memory, a display, and a power source, said ultra-thin circuit assembly having a maximum dimension of one inch;
said ultra-thin circuit assembly containing an extremely compact array of both environmental sensors and physical sensors for producing the sensor data associated with said asset;
said sensor data being stored in said memory for the future examination;
said ultra-thin circuit assembly containing communication circuitry enabling local and wireless access to said sensor data;
said power source supplying power to said microprocessor, said memory, said display, and said communication circuitry; and
whereby said ultra-thin circuit assembly can capture the changes in said sensor data in the real time associated with said asset, and can then log said sensor data in said memory for the future examination.