CPC H01L 29/66969 (2013.01) [H01L 21/477 (2013.01); H01L 29/7869 (2013.01); H01L 27/1225 (2013.01)] | 17 Claims |
1. A method of manufacturing a liquid crystal display comprising steps of:
forming a gate electrode over a substrate having an insulating surface;
forming a gate insulating film over the gate electrode;
forming an oxide semiconductor layer containing In, Ga, and Zn over the gate insulating film;
performing a first heat treatment on the oxide semiconductor layer in a first atmosphere;
cooling the oxide semiconductor layer in a second atmosphere after the first heat treatment;
forming a source electrode and a drain electrode over the oxide semiconductor layer after the step of cooling the oxide semiconductor layer;
forming an oxide insulating layer over the source electrode, the drain electrode and the oxide semiconductor layer;
performing a second heat treatment after forming the oxide insulating layer; and
forming a pixel electrode after the second heat treatment,
wherein the oxide insulating layer is in contact with the oxide semiconductor layer,
wherein the pixel electrode is electrically connected to the source electrode or the drain electrode, and
wherein each of the first atmosphere and the second atmosphere is formed by a gas that has been treated to reduce a concentration of moisture or a concentration of hydrogen.
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6. A method of manufacturing a liquid crystal display comprising steps of:
forming a gate electrode over a substrate having an insulating surface;
forming a gate insulating film over the gate electrode;
forming an oxide semiconductor layer containing In, Ga, and Zn over the gate insulating film;
performing a first heat treatment on the oxide semiconductor layer in a first atmosphere;
cooling the oxide semiconductor layer in a second atmosphere after the first heat treatment;
forming a source electrode and a drain electrode over the oxide semiconductor layer after the step of cooling the oxide semiconductor layer;
forming an oxide insulating layer over the source electrode, the drain electrode and the oxide semiconductor layer;
performing a second heat treatment after forming the oxide insulating layer; and
forming a pixel electrode after the second heat treatment,
wherein the oxide insulating layer is in contact with the oxide semiconductor layer,
wherein the pixel electrode is electrically connected to the source electrode or the drain electrode, and
wherein moisture or hydrogen is removed from each of the first atmosphere and the second atmosphere.
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10. A method of manufacturing a liquid crystal display comprising steps of:
forming a gate electrode over a substrate having an insulating surface;
forming a gate insulating film over the gate electrode;
forming an oxide semiconductor layer containing In, Ga, and Zn over the gate insulating film;
performing a first heat treatment on the oxide semiconductor layer;
cooling the oxide semiconductor layer after the first heat treatment;
forming a source electrode and a drain electrode over the oxide semiconductor layer after the step of cooling the oxide semiconductor layer;
forming an oxide insulating layer over the source electrode, the drain electrode and the oxide semiconductor layer;
performing a second heat treatment after forming the oxide insulating layer; and
forming a pixel electrode after the second heat treatment,
wherein the oxide insulating layer is in contact with the oxide semiconductor layer,
wherein the pixel electrode is electrically connected to the source electrode or the drain electrode, and
wherein the first heating and the cooling are performed in an atmosphere in which a concentration of moisture or a concentration of hydrogen is reduced by an apparatus for removing moisture or hydrogen.
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14. A method of manufacturing a liquid crystal display comprising steps of:
forming a gate electrode over a substrate having an insulating surface;
forming a gate insulating film over the gate electrode;
forming an oxide semiconductor layer containing In, Ga, and Zn over the gate insulating film;
performing a first heat treatment on the oxide semiconductor layer;
cooling the oxide semiconductor layer after the first heat treatment;
forming a source electrode and a drain electrode over the oxide semiconductor layer after the step of cooling the oxide semiconductor layer;
forming an oxide insulating layer over the source electrode, the drain electrode and the oxide semiconductor layer;
performing a second heat treatment after forming the oxide insulating layer; and
forming a pixel electrode after the second heat treatment,
wherein the oxide insulating layer is in contact with the oxide semiconductor layer,
wherein the pixel electrode is electrically connected to the source electrode or the drain electrode, and
wherein the first heating and the cooling are performed in an atmosphere from which moisture or hydrogen has been removed by an apparatus for removing moisture or hydrogen.
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