CPC H01L 28/91 (2013.01) [H01L 28/40 (2013.01); H01L 28/60 (2013.01); H01L 28/75 (2013.01); H01L 28/86 (2013.01); H01L 28/90 (2013.01)] | 20 Claims |
1. A method, comprising:
depositing a first insulation layer over a workpiece;
depositing a bottom conductor plate layer over the first insulation layer;
patterning the bottom conductor plate layer;
passivating sidewalls of the patterned bottom conductor plate layer;
depositing a first dielectric layer over the patterned bottom conductor plate layer;
depositing a middle conductor plate layer over the first dielectric layer;
patterning the middle conductor plate layer;
passivating sidewalls of the patterned middle conductor plate layer;
depositing a second dielectric layer over the patterned middle conductor plate layer;
depositing a top conductor plate layer over the second dielectric layer;
patterning the top conductor plate layer; and
passivating sidewalls of the patterned top conductor plate layer,
wherein the depositing of each of the bottom conductor plate layer, the middle conductor plate layer, and the top conductor plate layer comprises:
depositing a first metal nitride layer,
depositing a metal layer directly on the first metal nitride layer, and
depositing a second metal nitride layer directly on the metal layer.
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