US 11,855,108 B2
Solid-state imaging element and electronic device
Satoko Iida, Kanagawa (JP); Yoshiaki Kitano, Kanagawa (JP); Kengo Nagata, Kanagawa (JP); Toshiaki Ono, Kanagawa (JP); and Tomohiko Asatsuma, Kanagawa (JP)
Assigned to SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
Appl. No. 17/250,708
Filed by SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
PCT Filed Sep. 2, 2019, PCT No. PCT/JP2019/034348
§ 371(c)(1), (2) Date Feb. 22, 2021,
PCT Pub. No. WO2020/050195, PCT Pub. Date Mar. 12, 2020.
Claims priority of application No. 2018-165458 (JP), filed on Sep. 4, 2018.
Prior Publication US 2021/0202545 A1, Jul. 1, 2021
Int. Cl. H01L 27/146 (2006.01)
CPC H01L 27/1461 (2013.01) [H01L 27/14636 (2013.01); H01L 27/14643 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A solid-state imaging element, comprising:
a first photoelectric conversion element;
a first accumulation part configured to accumulate electric charges photoelectrically converted by the first photoelectric conversion element;
a second photoelectric conversion element;
a second accumulation part on a first face of a substrate and configured to accumulate electric charges photoelectrically converted by the second photoelectric conversion element; and
a connection part connected to the second accumulation part and configured to transfer the electric charges accumulated in the second accumulation part to a second face of the substrate.