US 11,855,047 B2
Chip package structure with conductive shielding film
Chen-Hua Yu, Hsinchu (TW); An-Jhih Su, Taoyuan (TW); Jing-Cheng Lin, Hsinchu (TW); and Po-Hao Tsai, Taoyuan (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Feb. 25, 2022, as Appl. No. 17/680,789.
Application 17/019,651 is a division of application No. 16/159,816, filed on Oct. 15, 2018, granted, now 10,804,247, issued on Oct. 13, 2020.
Application 16/159,816 is a division of application No. 15/362,690, filed on Nov. 28, 2016, granted, now 10,103,125, issued on Oct. 16, 2018.
Application 17/680,789 is a continuation of application No. 17/019,651, filed on Sep. 14, 2020, granted, now 11,264,363.
Prior Publication US 2022/0181305 A1, Jun. 9, 2022
Int. Cl. H01L 25/065 (2023.01); H01L 21/56 (2006.01); H01L 25/00 (2006.01); H01L 25/10 (2006.01); H01L 23/552 (2006.01); H01L 21/78 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 23/60 (2006.01); H01L 23/538 (2006.01); H01L 21/48 (2006.01)
CPC H01L 25/0657 (2013.01) [H01L 21/561 (2013.01); H01L 21/78 (2013.01); H01L 23/3128 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/552 (2013.01); H01L 23/562 (2013.01); H01L 23/60 (2013.01); H01L 25/105 (2013.01); H01L 25/50 (2013.01); H01L 21/486 (2013.01); H01L 21/568 (2013.01); H01L 23/49805 (2013.01); H01L 23/5389 (2013.01); H01L 2224/18 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/06568 (2013.01); H01L 2924/181 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A chip package structure, comprising:
a chip structure;
a first ground bump below the chip structure; and
a conductive shielding film disposed over the chip structure and extending onto the first ground bump, wherein the conductive shielding film has a curved bottom surface.