CPC H01L 24/48 (2013.01) [H01L 23/18 (2013.01); H01L 23/3107 (2013.01); H01L 23/48 (2013.01); H01L 24/85 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/85909 (2013.01); H01L 2924/181 (2013.01)] | 15 Claims |
1. A power semiconductor module comprising:
a semiconductor device including a front electrode;
at least one conductive wire bonded to the front electrode at a bonding section;
a first resin member;
a second resin member; and
a third resin member sealing the semiconductor device, the first resin member, and the second resin member, wherein
the first resin member extends along a first surface of the front electrode and a second surface of the conductive wire, and is bent at at least one end portion of two end portions of the bonding section in a longitudinal direction of the conductive wire, the first surface is connected to the at least one end portion of the two end portions of the bonding section and faces the conductive wire, the second surface is connected to the at least one end portion of the two end portions of the bonding section and faces the front electrode,
the first resin member covers the at least one end portion of the two end portions of the bonding section, the first surface, and the second surface,
the second resin member covers a bent portion of the first resin member,
a first break elongation of the first resin member is greater than a second break elongation of the second resin member,
a first break strength of the first resin member is greater than a second break strength of the second resin member, and
a second tensile elastic modulus of the second resin member is greater than a first tensile elastic modulus of the first resin member.
|