US 11,855,022 B2
Shielding structures
Chih-Fan Huang, Kaohsiung (TW); Hui-Chi Chen, Hsinchu County (TW); Kuo-Chin Chang, Chiayi (TW); Chien-Huang Yeh, Hsinchu (TW); Hong-Seng Shue, Hsinchu County (TW); Dian-Hau Chen, Hsinchu (TW); and Yen-Ming Chen, Hsin-Chu County (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Jun. 30, 2022, as Appl. No. 17/854,840.
Application 17/854,840 is a continuation of application No. 17/114,112, filed on Dec. 7, 2020, granted, now 11,380,639.
Application 17/114,112 is a continuation of application No. 16/392,024, filed on Apr. 23, 2019, granted, now 10,861,810, issued on Dec. 8, 2020.
Claims priority of provisional application 62/771,691, filed on Nov. 27, 2018.
Prior Publication US 2022/0328440 A1, Oct. 13, 2022
Int. Cl. H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H01L 23/522 (2006.01)
CPC H01L 24/06 (2013.01) [H01L 21/4814 (2013.01); H01L 21/4846 (2013.01); H01L 21/4853 (2013.01); H01L 23/49816 (2013.01); H01L 23/5223 (2013.01); H01L 24/02 (2013.01); H01L 24/05 (2013.01); H01L 24/07 (2013.01); H01L 24/10 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05005 (2013.01); H01L 2224/05008 (2013.01); H01L 2224/05015 (2013.01); H01L 2224/05555 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/16227 (2013.01)] 20 Claims
OG exemplary drawing
 
10. A device package, comprising:
a rectangular substrate having four corners and four triangular regions, each of the four triangular regions sharing one of the four corners with the rectangular substrate, the four triangular regions defining a first region and an area of the rectangular substrate outside the first region defining a second region;
a plurality of first-type contact pads disposed directly over the first region;
a plurality of second-type contact pads disposed directly over the second region; and
a plurality of under-bump metallization (UBM) features, each of the plurality of UBM features being disposed directly over one of the plurality of first-type contact pads,
wherein each of the plurality of first-type contact pads is different from each of the plurality of second-type contact pads,
wherein a vertical projection area of each of the plurality of UBM features falls completely within a vertical projection area of the underlying one of the plurality of first-type contact pads.