US 11,854,995 B2
Supports for thinned semiconductor substrates and related methods
Michael J. Seddon, Gilbert, AZ (US); and Francis J. Carney, Mesa, AZ (US)
Assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US)
Filed by SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Phoenix, AZ (US)
Filed on Apr. 29, 2020, as Appl. No. 16/862,270.
Prior Publication US 2021/0343655 A1, Nov. 4, 2021
Int. Cl. H01L 23/544 (2006.01); H01L 23/14 (2006.01); H01L 25/065 (2023.01); H01L 23/32 (2006.01)
CPC H01L 23/544 (2013.01) [H01L 23/145 (2013.01); H01L 23/32 (2013.01); H01L 25/0655 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor substrate comprising:
a uniformly thinned wafer comprising a first side and a second side; and
a support structure separate from a material of the uniformly thinned wafer coupled to the uniformly thinned wafer at a desired location on the first side, the second side, or both the first side and the second side;
wherein the support structure comprises an organic compound;
wherein the support structure comprises a first spoke, a second spoke, and a third spoke; and
wherein an area of the support structure is smaller than an area of either the first side or the second side.