US 11,854,989 B2
Semiconductor package substrate and semiconductor package including the same
Dongho Kim, Seoul (KR); Jongbo Shim, Asan-si (KR); Hwan Pil Park, Hwaseong-si (KR); Choongbin Yim, Seoul (KR); and Jungwoo Kim, Osan-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Feb. 4, 2021, as Appl. No. 17/167,789.
Claims priority of application No. 10-2020-0078007 (KR), filed on Jun. 25, 2020.
Prior Publication US 2021/0407923 A1, Dec. 30, 2021
Int. Cl. H01L 23/538 (2006.01); H01L 23/13 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 25/10 (2006.01); H01L 25/065 (2023.01)
CPC H01L 23/5389 (2013.01) [H01L 23/13 (2013.01); H01L 23/3128 (2013.01); H01L 23/5383 (2013.01); H01L 23/5386 (2013.01); H01L 24/20 (2013.01); H01L 25/0657 (2013.01); H01L 25/105 (2013.01); H01L 2224/214 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06586 (2013.01); H01L 2225/1035 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/19103 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor package substrate, comprising:
a substrate having a bottom surface including a cavity structure defined therein, the cavity structure including a floor surface, a first cavity and a second cavity, the first and second cavities having different widths from each other; and
a passive device structure having at least a partial portion of the passive device structure disposed in the cavity structure,
wherein the passive device structure includes a first passive device and a second passive device that are each connected to the floor surface of the cavity structure,
wherein at least partial portions of the first passive device and the second passive device vertically overlap each other,
wherein a longest dimension of the first passive device is perpendicular to a longest dimension of the second passive device,
wherein the first passive device is disposed in the first cavity and is not disposed in the second cavity, and
wherein the second passive device is disposed in the second cavity and is not disposed in the first cavity.