US 11,854,985 B2
Semiconductor package and method of manufacturing the same
Heejung Choi, Seongnam-si (KR); Heeseok Lee, Suwon-si (KR); and Junghwa Kim, Seoul (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on May 4, 2021, as Appl. No. 17/307,037.
Claims priority of application No. 10-2020-0112920 (KR), filed on Sep. 4, 2020.
Prior Publication US 2022/0077064 A1, Mar. 10, 2022
Int. Cl. H01L 23/538 (2006.01); H01L 25/065 (2023.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01)
CPC H01L 23/5383 (2013.01) [H01L 21/486 (2013.01); H01L 23/49833 (2013.01); H01L 24/19 (2013.01); H01L 24/24 (2013.01); H01L 25/0652 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 2224/24146 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A semiconductor package, comprising:
a first package including a first semiconductor chip;
a second package under the first package, the second package including a second semiconductor chip; and
a first interposer package between the first package and the second package, the first interposer package including:
a power management integrated circuit (PMIC) configured to supply power to the first package and the second package;
a core member having a through-hole in which the PMIC is disposed;
a first redistribution layer on the core member, and electrically connected to the first package via first solder balls;
a second redistribution layer under the core member, and electrically connected to the second package via second solder balls;
core vias penetrating the core member, and electrically connecting the first redistribution layer with the second redistribution layer;
a first signal path electrically connecting the first package with the second package, the first signal path including only elements in the first redistribution layer, elements in the second redistribution layer, and one of the core vias,
a power path configured to provide a power supply voltage to the first package and the second package,
a first power control path from the PMIC only to the first package among the first and second packages, and configured to provide a first control signal that controls provision of the power supply voltage to the first package, and
a second power control path from the PMIC only to the second package among the first and second packages, and configured to provide a second control signal that controls provision of the power supply voltage to the second package.