US 11,854,957 B2
Integrated circuit device, device, and manufacturing method
Naoki Il, Suwa (JP); and Yosuke Itasaka, Minowa (JP)
Assigned to SEIKO EPSON CORPORATION
Filed by Seiko Epson Corporation, Tokyo (JP)
Filed on Mar. 28, 2022, as Appl. No. 17/705,668.
Claims priority of application No. 2021-054805 (JP), filed on Mar. 29, 2021.
Prior Publication US 2022/0310504 A1, Sep. 29, 2022
Int. Cl. H01L 23/50 (2006.01); H03H 9/05 (2006.01); H03H 9/10 (2006.01); H03H 9/17 (2006.01); H03B 5/36 (2006.01); H03H 3/02 (2006.01); H01L 23/00 (2006.01)
CPC H01L 23/50 (2013.01) [H03B 5/36 (2013.01); H03H 3/02 (2013.01); H03H 9/0557 (2013.01); H03H 9/1021 (2013.01); H03H 9/178 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 2224/05083 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/05155 (2013.01); H01L 2224/05164 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81206 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An integrated circuit device comprising:
a pad that has a shape having a longitudinal direction and a lateral direction;
a circuit that overlaps the pad in a plan view, and that is electrically coupled to the pad;
a lead-out wiring that is led out from an outer edge on a longitudinal side of the pad along the lateral direction of the pad; and
a via group that electrically couples the lead-out wiring and a wiring of the circuit and that does not overlap the pad in the plan view,
wherein the lead-out wiring has a shape whose longitudinal direction is the longitudinal direction of the pad.