CPC H01L 23/50 (2013.01) [H03B 5/36 (2013.01); H03H 3/02 (2013.01); H03H 9/0557 (2013.01); H03H 9/1021 (2013.01); H03H 9/178 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 2224/05083 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/05155 (2013.01); H01L 2224/05164 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81206 (2013.01)] | 20 Claims |
1. An integrated circuit device comprising:
a pad that has a shape having a longitudinal direction and a lateral direction;
a circuit that overlaps the pad in a plan view, and that is electrically coupled to the pad;
a lead-out wiring that is led out from an outer edge on a longitudinal side of the pad along the lateral direction of the pad; and
a via group that electrically couples the lead-out wiring and a wiring of the circuit and that does not overlap the pad in the plan view,
wherein the lead-out wiring has a shape whose longitudinal direction is the longitudinal direction of the pad.
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