US 11,854,954 B2
Integrated circuit and electronic device comprising a plurality of integrated circuits electrically coupled through a synchronization signal routed through the integrated circuit
Angelo Scuderi, Catania (IT); and Nicola Marinelli, Mediglia (IT)
Assigned to STMicroelectronics S.r.l., Agrate Brianza (IT)
Filed by STMicroelectronics S.r.l., Agrate Brianza (IT)
Filed on Jan. 26, 2021, as Appl. No. 17/158,776.
Claims priority of application No. 102020000001822 (IT), filed on Jan. 30, 2020.
Prior Publication US 2021/0242116 A1, Aug. 5, 2021
Int. Cl. H01L 23/498 (2006.01); H01L 23/14 (2006.01); H01L 23/66 (2006.01); H01L 23/00 (2006.01); H04W 56/00 (2009.01)
CPC H01L 23/49816 (2013.01) [H01L 23/14 (2013.01); H01L 23/66 (2013.01); H01L 24/14 (2013.01); H04W 56/00 (2013.01); H01L 2223/6683 (2013.01); H01L 2924/1423 (2013.01)] 19 Claims
OG exemplary drawing
 
1. An electronic device comprising:
a support having a support face and a first side and a second side;
a plurality of integrated circuits arranged in a line, each integrated circuit having a coupling face coupled to the support face and including: a semiconductor substrate;
electronic components integrated in the semiconductor substrate;
a connection substrate overlying the semiconductor substrate;
a plurality of conductive strips, with elongated shape, having a first end and a second end, the plurality of conductive strips being formed in the connection substrate and not being directly electrically connected to the electronic components; and
a plurality of solder balls coupled to the support face, a first group of the plurality of solder balls coupled to each first end and a second group of the plurality of solder balls coupled to each second end; and
a plurality of track portions bonded to the support face and coupled to the plurality of solder balls,
wherein:
the connection substrate includes a plurality of connection lines, and
a first integrated circuit of the plurality of integrated circuits is configured to generate a synchronization signal, and
each integrated circuit includes an input terminal electrically coupled to one of the plurality of track portions bonded to the support face, and
the first integrated circuit of the plurality of integrated circuits includes an output terminal electrically coupled to one of the plurality of track portions bonded to the support face, and
a synchronization line comprised of the plurality of conductive strips is electrically coupled to the track portion of each integrated circuit, and
the solder balls coupled to the first integrated circuit and at least one other integrated circuit are coupled to the synchronization line and the solder balls coupled to at least the integrated circuits closest in proximity to the first side and the second side of the support are not coupled to the synchronization line.