US 11,854,934 B2
Package with heat dissipating substrate
Noriyasu Yamamoto, Sanyo-Onoda (JP); Yoshikazu Mihara, Shimonoseki (JP); and Naoya Shirai, Mine (JP)
Assigned to NGK ELECTRONICS DEVICES, INC., Mine (JP); and NGK INSULATORS, LTD., Nagoya (JP)
Filed by NGK ELECTRONICS DEVICES, INC., Mine (JP); and NGK INSULATORS, LTD., Nagoya (JP)
Filed on Mar. 22, 2022, as Appl. No. 17/700,720.
Claims priority of application No. 2021-074850 (JP), filed on Apr. 27, 2021.
Prior Publication US 2022/0344241 A1, Oct. 27, 2022
Int. Cl. H01L 23/373 (2006.01); H01L 23/367 (2006.01)
CPC H01L 23/3735 (2013.01) [H01L 23/367 (2013.01)] 5 Claims
OG exemplary drawing
 
1. A package having a cavity to be sealed by a lid, the package comprising:
a frame being made of ceramics and surrounding the cavity in plan view; and
a heat sink having a support surface to support the frame, the heat sink including:
a first layer having the support surface, being made of copper, and having a thickness t1;
a second layer laminated to the first layer, being made of molybdenum, and having a thickness t2;
a third layer laminated to the second layer, being made of copper, and having a thickness t3;
a fourth layer laminated to the third layer, being made of molybdenum, and having a thickness t4; and
a fifth layer laminated to the fourth layer, being made of copper, and having a thickness t5,
wherein conditions below are satisfied:
3≤t1/t5≤5; and
3≤t3/t5≤5.