US 11,854,923 B2
Semiconductor device
Koshun Saito, Kyoto (JP)
Assigned to ROHM CO., LTD., Kyoto (JP)
Filed by ROHM CO., LTD., Kyoto (JP)
Filed on Oct. 5, 2022, as Appl. No. 17/960,632.
Application 17/960,632 is a continuation of application No. 17/268,277, granted, now 11,502,014, previously published as PCT/JP2019/036556, filed on Sep. 18, 2019.
Claims priority of application No. 2018-174815 (JP), filed on Sep. 19, 2018.
Prior Publication US 2023/0030063 A1, Feb. 2, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/495 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01)
CPC H01L 23/3121 (2013.01) [H01L 23/49513 (2013.01); H01L 23/49562 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/29147 (2013.01); H01L 2224/29155 (2013.01); H01L 2224/29166 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/48175 (2013.01); H01L 2224/73265 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A semiconductor device comprising:
a semiconductor element including: an element main face and an element back face that face opposite to each other in a thickness direction; a first electrode located on the element back face; and a second electrode located on the element main face;
a first lead including: a mounting base having a mounting base main face to which the first electrode of the semiconductor element is bonded and a mounting base back face opposite to the mounting base main face in the thickness direction; and a first terminal electrically connected to the first electrode via the mounting base;
a second lead including a second terminal electrically connected to the second electrode; and
a sealing resin covering a part of each of the first lead and the second lead, and the semiconductor element,
wherein the first terminal and the second terminal protrude from the sealing resin,
the sealing resin includes: a resin main face and a resin back face oriented in opposite directions to each other in the thickness direction; a resin end face connecting the resin main face and the resin back face, and oriented in the direction in which the first terminal and the second terminal protrude; and a pair of resin side faces each connecting the resin main face and the resin back face, and connected to the resin end face,
the mounting base back face is exposed from the resin back face,
the sealing resin includes a depression between the mounting base back face and an interface between a portion of the first lead exposed from the sealing resin and an edge line of the sealing resin in a plan view.