US 11,854,922 B2
Semicondutor package substrate with die cavity and redistribution layer
Vivek Swaminathan Sridharan, Dallas, TX (US); Christopher Daniel Manack, Flower Mound, TX (US); and Joseph Liu, Plano, TX (US)
Assigned to Texas Instruments Incorporated, Dallas, TX (US)
Filed by TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed on Jun. 21, 2021, as Appl. No. 17/353,805.
Prior Publication US 2022/0406673 A1, Dec. 22, 2022
Int. Cl. H01L 23/31 (2006.01); H01L 23/00 (2006.01)
CPC H01L 23/3121 (2013.01) [H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 24/24 (2013.01); H01L 24/73 (2013.01); H01L 24/92 (2013.01); H01L 24/97 (2013.01); H01L 24/02 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 2224/0233 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/19 (2013.01); H01L 2224/221 (2013.01); H01L 2224/244 (2013.01); H01L 2224/24137 (2013.01); H01L 2224/24155 (2013.01); H01L 2224/32137 (2013.01); H01L 2224/32155 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73209 (2013.01); H01L 2224/73217 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/9211 (2013.01); H01L 2224/92125 (2013.01); H01L 2224/92135 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19104 (2013.01)] 24 Claims
OG exemplary drawing
 
1. A semiconductor package, comprising:
a semiconductor substrate including a cavity;
a redistribution layer on a first side of the semiconductor substrate, the redistribution layer
forming die contacts within the cavity on a first side of the semiconductor substrate and a set of terminals of the semiconductor package on a second side of the semiconductor substrate,
wherein the redistribution layer electrically connects one or more of the die contacts to the set of terminals; and
a semiconductor die including die terminals within the cavity with the die terminals electrically coupled to the die contacts within the cavity.