US 11,854,919 B2
Sealing composition and semiconductor device
Dongchul Kang, Tokyo (JP); Takahiro Horie, Tokyo (JP); Kenta Ishibashi, Tokyo (JP); Naoki Namai, Tokyo (JP); Kazuhide Sekiguchi, Tokyo (JP); and Keichi Hori, Tokyo (JP)
Assigned to RESONAC CORPORATION, Tokyo (JP)
Appl. No. 16/305,285
Filed by HITACHI CHEMICAL COMPANY, LTD., Tokyo (JP)
PCT Filed May 29, 2017, PCT No. PCT/JP2017/019913
§ 371(c)(1), (2) Date Nov. 28, 2018,
PCT Pub. No. WO2017/209047, PCT Pub. Date Dec. 7, 2017.
Claims priority of application No. 2016-107024 (JP), filed on May 30, 2016; application No. 2016-107025 (JP), filed on May 30, 2016; and application No. 2016-107026 (JP), filed on May 30, 2016.
Prior Publication US 2020/0335409 A1, Oct. 22, 2020
Int. Cl. H01L 23/29 (2006.01); C08L 63/00 (2006.01); C08K 3/26 (2006.01); C08K 3/22 (2006.01)
CPC H01L 23/295 (2013.01) [C08K 3/26 (2013.01); C08L 63/00 (2013.01); C08K 2003/222 (2013.01); C08K 2003/2227 (2013.01); C08L 2203/206 (2013.01); C08L 2205/025 (2013.01); C08L 2205/03 (2013.01)] 13 Claims
 
1. A sealing composition comprising:
an epoxy resin,
a curing agent,
an inorganic filler comprising magnesium oxide and silica, wherein a ratio by mass of magnesium oxide and silica (magnesium oxide/silica) is 30/1986 to 30/1363 and wherein the magnesium oxide is surface-treated with an inorganic substance to reduce hygroscopicity, and
an unbaked hydrotalcite compound having a mole ratio of Mg ion to Al ion (Mg/Al) of 2.4 or more.