US 11,854,892 B2
Substrate dicing method, method of fabricating semiconductor device, and semiconductor chip fabricated by them
Junho Yoon, Anyang-si (KR); Jungchul Lee, Hwaseong-si (KR); Byungmoon Bae, Daegu (KR); Junggeun Shin, Cheonan-si (KR); and Hyunsu Sim, Cheonan-si (KR)
Assigned to Samsung Electronics Co., Ltd., Gyeonggi-do (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Mar. 21, 2022, as Appl. No. 17/699,570.
Application 17/699,570 is a division of application No. 16/909,136, filed on Jun. 23, 2020, granted, now 11,322,405.
Claims priority of application No. 10-2019-0151826 (KR), filed on Nov. 25, 2019.
Prior Publication US 2022/0208610 A1, Jun. 30, 2022
Int. Cl. H01L 21/78 (2006.01); H01L 21/268 (2006.01); H01L 21/683 (2006.01); H01L 21/304 (2006.01)
CPC H01L 21/78 (2013.01) [H01L 21/268 (2013.01); H01L 21/304 (2013.01); H01L 21/6836 (2013.01); H01L 2221/68336 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A laser apparatus, comprising:
a light source generating a laser beam;
an objective lens receiving the laser beam;
a first axicon lens between the objective lens and the light source; and
a second axicon lens between the first axicon lens and the objective lens,
wherein the first axicon lens and the second axicon lens include a first inclined surface and a second inclined surface, respectively, which are inclined at an inclination angle of 50° to 54° with respect to an optical axis of the laser beam, and
wherein the objective lens, the first axicon lens, and the second axicon lens are spaced apart from each other in a linear direction and the linear direction corresponds to the optical axis of the laser beam when the light source generates the laser beam,
wherein the objective lens has a numerical aperture of 0.8, and
wherein the inclination angle of the first inclined surface and the second inclined surface with respect to the optical axis are 51.3°.