US 11,854,889 B2
Die cleaning systems and related methods
Michael J. Seddon, Gilbert, AZ (US)
Assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US)
Filed by SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Phoenix, AZ (US)
Filed on Jul. 15, 2020, as Appl. No. 16/929,542.
Application 16/929,542 is a division of application No. 15/988,874, filed on May 24, 2018, abandoned.
Prior Publication US 2020/0350208 A1, Nov. 5, 2020
Int. Cl. H01L 21/78 (2006.01); H01L 21/268 (2006.01); H01L 21/02 (2006.01); H01L 21/304 (2006.01); H01L 21/683 (2006.01); H01L 23/544 (2006.01); B23K 26/53 (2014.01); B23K 26/00 (2014.01); B23K 101/40 (2006.01)
CPC H01L 21/78 (2013.01) [H01L 21/02076 (2013.01); H01L 21/268 (2013.01); H01L 21/3043 (2013.01); H01L 21/6836 (2013.01); H01L 23/544 (2013.01); B23K 26/0006 (2013.01); B23K 26/53 (2015.10); B23K 2101/40 (2018.08); H01L 2223/5446 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A method of forming a plurality of semiconductor die, the method comprising:
forming a damage layer beneath a surface of a die street in a semiconductor substrate using a laser;
ablating only a portion of material of the die street using the laser;
singulating the semiconductor substrate into a plurality of semiconductor die through sawing along the die street;
removing one or more particulates in the die street after singulating through applying sonic energy to the plurality of semiconductor die; and
spraying the plurality of semiconductor die with a liquid while applying the sonic energy;
wherein the sonic energy is applied directly to a spindle coupled with a chuck and transmitted to the chuck through the spindle, wherein the semiconductor substrate is upon the chuck.