US 11,854,841 B2
Space filling device for wet bench
Yen-Ji Chen, Hsinchu (TW); Chih-Shen Yang, Hsinchu (TW); and Cheng-Yi Huang, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Jul. 25, 2022, as Appl. No. 17/873,054.
Application 17/873,054 is a division of application No. 16/430,329, filed on Jun. 3, 2019, granted, now 11,482,430.
Claims priority of provisional application 62/772,423, filed on Nov. 28, 2018.
Prior Publication US 2022/0359236 A1, Nov. 10, 2022
Int. Cl. H01L 21/67 (2006.01); B08B 9/08 (2006.01); H01L 21/02 (2006.01); H01L 21/687 (2006.01); B08B 3/08 (2006.01)
CPC H01L 21/67057 (2013.01) [B08B 9/08 (2013.01); H01L 21/02057 (2013.01); H01L 21/67023 (2013.01); H01L 21/68707 (2013.01); B08B 3/08 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method, comprising:
immersing a semiconductor wafer in a first chemical solution contained in a tank;
removing the first chemical solution from the tank;
cleaning the tank with deionized water;
after the cleaning the tank with the deionized water, positioning a space filling device within the tank;
purging the tank using a second chemical solution with the space filling device remaining within the tank; and
during the purging the tank using the second chemical solution, excluding the second chemical solution from an interior volume of the space filling device.