CPC H01L 21/67057 (2013.01) [B08B 9/08 (2013.01); H01L 21/02057 (2013.01); H01L 21/67023 (2013.01); H01L 21/68707 (2013.01); B08B 3/08 (2013.01)] | 20 Claims |
1. A method, comprising:
immersing a semiconductor wafer in a first chemical solution contained in a tank;
removing the first chemical solution from the tank;
cleaning the tank with deionized water;
after the cleaning the tank with the deionized water, positioning a space filling device within the tank;
purging the tank using a second chemical solution with the space filling device remaining within the tank; and
during the purging the tank using the second chemical solution, excluding the second chemical solution from an interior volume of the space filling device.
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