US 11,854,793 B2
Semiconductor wafer cleaning apparatus
Chia-Lun Chen, Taichung (TW); Po-Jen Shih, Tainan (TW); Ming-Sung Hung, Taichung (TW); and Wen-Hung Hsu, Taichung (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Apr. 16, 2021, as Appl. No. 17/232,218.
Application 17/232,218 is a continuation of application No. 15/706,959, filed on Sep. 18, 2017, granted, now 10,991,570.
Prior Publication US 2021/0233766 A1, Jul. 29, 2021
Int. Cl. H01L 21/02 (2006.01); H01L 21/67 (2006.01); B08B 1/00 (2006.01); B08B 1/04 (2006.01); B08B 3/02 (2006.01); H01L 21/687 (2006.01); H01L 21/304 (2006.01)
CPC H01L 21/02057 (2013.01) [B08B 1/001 (2013.01); B08B 1/007 (2013.01); B08B 1/04 (2013.01); B08B 3/024 (2013.01); H01L 21/0206 (2013.01); H01L 21/304 (2013.01); H01L 21/6704 (2013.01); H01L 21/67051 (2013.01); H01L 21/68728 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor wafer cleaning apparatus, comprising:
a spin base having a through hole and a flange protruding upward from a top surface of the spin base;
a spindle extending through the through hole;
a clamping member covering the through hole and connected to the spindle, wherein the clamping member comprises a mounting part, a supporting part disposed on the mounting part, and an abutment member comprising a pillar and a ridge disposed on the supporting part, wherein the pillar is higher than the ridge; and
a first sealing ring disposed under the clamping member, wherein a top surface of the first sealing ring and a top surface of the flange are in contact with a bottom surface of the mounting part.