CPC H01L 23/528 (2013.01) [H01L 23/5226 (2013.01); H01L 23/5329 (2013.01); H01L 23/53238 (2013.01); H01L 27/0886 (2013.01); H01L 29/7848 (2013.01)] | 19 Claims |
14. A target structure for fabricating an integrated circuit structure, the target structure comprising:
a first set of spacers above a hardmask layer above a substrate, the first set of spacers having a first material composition;
a second set of spacers along outer sidewalls of each of the first set of spacers, the second set of spacers having a second material composition different than the first material composition;
a third set of spacers along inner sidewalls of each of the first set of spacers, the third set of spacers having the second material composition; and
a final feature in an opening between adjacent pairs of spacers of the third set of spacers.
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