US 11,854,777 B2
Ion-to-electron conversion dynode for ion imaging applications
Oleg Silivra, Milpitas, CA (US); Alan E. Schoen, Kilauea, HI (US); Johnathan W. Smith, Round Rock, TX (US); and Berg A. Tehlirian, Daly City, CA (US)
Assigned to Thermo Finnigan LLC, San Jose, CA (US)
Filed by Thermo Finnigan LLC, San Jose, CA (US)
Filed on Jul. 28, 2020, as Appl. No. 16/941,124.
Claims priority of provisional application 62/879,605, filed on Jul. 29, 2019.
Prior Publication US 2021/0035789 A1, Feb. 4, 2021
Int. Cl. H01J 43/24 (2006.01); H01J 49/02 (2006.01)
CPC H01J 43/246 (2013.01) [H01J 49/025 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A metal-channel conversion dynode comprising:
a wafer comprising a first face and a second face parallel to the first face, the wafer having a thickness less than 1000 μm and comprising either tungsten, molybdenum, or a tungsten or molybdenum alloy having chemical purity of 90-99%; and
a plurality of channels passing through the wafer from the first face to the second face at an angle to a plane of the first face and a plane of the second face,
wherein no direct line of sight exists through any channel in the plurality of channels of the wafer along a sightline that is normal to the first and second faces.