CPC H01J 37/32825 (2013.01) [H01J 37/32357 (2013.01); H01J 37/32449 (2013.01); H01J 37/32889 (2013.01)] | 20 Claims |
1. A method of cleaning a chamber for an electronics manufacturing system, comprising:
machining one or more components of the chamber for the electronics manufacturing system;
assembling the chamber using the one or more components, wherein after assembly the chamber comprises a plurality of organic contaminants;
temporarily connecting a portable remote plasma generator to a port or window of the chamber;
flowing a gas mixture comprising oxygen and a carrier gas into the remote plasma generator;
generating a plasma from the gas mixture by the remote plasma generator;
performing a remote plasma cleaning of the chamber by flowing the plasma into an interior of the chamber, wherein the plasma removes the plurality of organic contaminants from the chamber; and
disconnecting the portable remote plasma generator from the port or window of the chamber after performing the remote plasma cleaning.
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