US 11,854,771 B2
Film stress control for plasma enhanced chemical vapor deposition
Chien-Teh Kao, Sunnyvale, CA (US); Tae Kyung Won, San Jose, CA (US); Carl A. Sorensen, Morgan Hill, CA (US); Sanjay D. Yadav, Morgan Hill, CA (US); Young Dong Lee, Hwaseong-Si (KR); Shinichi Kurita, San Jose, CA (US); and Soo Young Choi, Fremont, CA (US)
Assigned to APPLIED MATERIALS, INC., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on May 24, 2021, as Appl. No. 17/328,509.
Application 17/328,509 is a continuation of application No. 16/221,322, filed on Dec. 14, 2018, granted, now 11,094,508.
Prior Publication US 2021/0280392 A1, Sep. 9, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. H01J 37/32 (2006.01); H01L 21/683 (2006.01); C23C 16/455 (2006.01); C23C 16/52 (2006.01); H01L 21/02 (2006.01)
CPC H01J 37/32449 (2013.01) [C23C 16/45565 (2013.01); C23C 16/52 (2013.01); H01J 37/321 (2013.01); H01J 37/32174 (2013.01); H01J 37/32458 (2013.01); H01J 37/32715 (2013.01); H01L 21/02274 (2013.01); H01L 21/6833 (2013.01); H01J 2237/3321 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A plasma deposition chamber, comprising:
a showerhead having a plurality of perforated members, each of the perforated members supported by adjacent support members of a plurality of support members;
a plurality of dielectric plates disposed above the plurality of perforated members, each dielectric plate supported by the adjacent support members, wherein
a respective perforated member, a respective dielectric plate, and the adjacent support members define a gas volume, the gas volume in fluid communication with the adjacent support members; and
a respective dielectric plate, the showerhead, and the adjacent support members define a coil volume;
a plurality of inductive coils, each inductive coil supported by each dielectric plate in the coil volume; and
a substrate support assembly.