US 11,854,744 B2
Multilayer electronic component
Jinkyung Park, Suwon-si (KR); Dongjin Kim, Suwon-si (KR); Sunil Jeong, Suwon-si (KR); Suji Kang, Suwon-si (KR); and Mun Seong Jeong, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Aug. 10, 2021, as Appl. No. 17/398,602.
Claims priority of application No. 10-2020-0173403 (KR), filed on Dec. 11, 2020.
Prior Publication US 2022/0189692 A1, Jun. 16, 2022
Int. Cl. H01G 4/12 (2006.01); H01G 4/008 (2006.01); H01G 4/012 (2006.01); H01G 4/30 (2006.01)
CPC H01G 4/1218 (2013.01) [H01G 4/008 (2013.01); H01G 4/012 (2013.01); H01G 4/30 (2013.01)] 26 Claims
OG exemplary drawing
 
1. A multilayer electronic component comprising:
a sintered body including a dielectric layer and internal electrodes having the dielectric layer interposed therebetween in a first direction; and
external electrodes disposed on the sintered body and connected to the internal electrodes,
wherein the internal electrodes include nickel (Ni) and dysprosium (Dy) in amounts satisfying formula: 0.02 at %≤C0≤5 at % in which C0 is an atomic percentage (at %) calculated by dividing a number of atoms of Dy by a sum of a number of atoms of Ni and Dy included in the internal electrodes.