US 11,854,186 B2
Comparison method and modeling method for chip product, device and storage medium
Jiemei Zhang, Hefei (CN); and Gehua Shen, Hefei (CN)
Assigned to CHANGXIN MEMORY TECHNOLOGIES, INC., Hefei (CN)
Filed by CHANGXIN MEMORY TECHNOLOGIES, INC., Hefei (CN)
Filed on Jul. 30, 2021, as Appl. No. 17/389,735.
Application 17/389,735 is a continuation of application No. PCT/CN2021/097394, filed on May 31, 2021.
Claims priority of application No. 202011010056.7 (CN), filed on Sep. 23, 2020.
Prior Publication US 2022/0092759 A1, Mar. 24, 2022
Int. Cl. G06T 7/00 (2017.01); G06T 19/00 (2011.01); G06V 10/75 (2022.01); G06V 20/64 (2022.01)
CPC G06T 7/001 (2013.01) [G06T 19/003 (2013.01); G06V 10/754 (2022.01); G06V 20/647 (2022.01); G06T 2207/10021 (2013.01); G06T 2207/20084 (2013.01); G06T 2207/30148 (2013.01); G06T 2219/012 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A comparison method for a chip product, comprising:
when a comparison task for at least two chip products is acquired, acquiring a comparison feature responsive to an operation of a user;
for each chip product of the at least two chip products, acquiring a comparison result corresponding to the comparison feature from a three-dimensional stereoscopic model corresponding to the chip product, wherein the three-dimensional stereoscopic model corresponding to each chip product is a three-dimensional model which is recombined and constructed by using a neural network according to a slice sequence of the chip product; and
displaying the comparison result corresponding to each chip product,
wherein:
the comparison feature comprises three-dimensional position coordinates of a chip product required to be compared; and acquiring the comparison feature responsive to the operation of the user comprises:
responsive to a position being selected by the user in the three-dimensional stereoscopic model of any one of the at least two chip products, acquiring the three-dimensional position coordinates corresponding to the selected position,
wherein for each chip product, acquiring the comparison result corresponding to the comparison feature from the three-dimensional stereoscopic model corresponding to the chip product comprises:
for each chip product, positioning a two-dimensional plane position in the three-dimensional stereoscopic model corresponding to the chip product according to the three-dimensional position coordinates,
acquiring a slice image corresponding to the two-dimensional plane position from the slice sequence corresponding to the chip product, and
acquiring parameter information at the three-dimensional position coordinates from stored parameters of the chip product,
wherein the comparison result comprises the slice image and the parameter information; or,
the comparison feature comprises the parameter information of the chip product required to be compared; and acquiring the comparison feature responsive to the operation of the user comprises:
receiving the parameter information of the chip product required to be compared input by the user,
wherein for each chip product, acquiring the comparison result corresponding to the comparison feature from the three-dimensional stereoscopic model corresponding to the chip product comprises:
for each chip product, positioning the three-dimensional position coordinates corresponding to the parameter information in the three-dimensional stereoscopic model corresponding to the chip product,
positioning the two-dimensional plane position in the three-dimensional stereoscopic model corresponding to the chip product according to the three-dimensional position coordinates, and
acquiring the slice image corresponding to the two-dimensional plane position from the slice sequence corresponding to the chip product,
wherein the comparison result comprises the three-dimensional position coordinates and the slice image.