US 11,853,250 B2
Interconnect interface
Weilin Wang, Beijing (CN); Fan Yang, Beijing (CN); Shuai Zhang, Beijing (CN); Chunhui Zheng, Beijing (CN); and Peng Shen, Beijing (CN)
Assigned to SHANGHAI ZHAOXIN SEMICONDUCTOR CO., LTD., Shanghai (CN)
Filed by Shanghai Zhaoxin Semiconductor Co., Ltd., Shanghai (CN)
Filed on Oct. 20, 2021, as Appl. No. 17/506,124.
Claims priority of application No. 202111141627.5 (CN), filed on Sep. 28, 2021; application No. 202111142578.7 (CN), filed on Sep. 28, 2021; application No. 202111142579.1 (CN), filed on Sep. 28, 2021; and application No. 202111142604.6 (CN), filed on Sep. 28, 2021.
Prior Publication US 2023/0095940 A1, Mar. 30, 2023
Int. Cl. G06F 13/42 (2006.01); H04L 45/02 (2022.01); H04L 45/00 (2022.01); H04L 45/745 (2022.01); H04L 45/42 (2022.01); G06F 15/78 (2006.01); G06F 13/40 (2006.01); H04L 1/00 (2006.01); H04L 69/324 (2022.01); G06F 1/3234 (2019.01); G06F 9/4401 (2018.01); G06F 9/48 (2006.01); G06F 13/16 (2006.01)
CPC G06F 13/4265 (2013.01) [G06F 1/3234 (2013.01); G06F 9/4418 (2013.01); G06F 9/4812 (2013.01); G06F 13/1668 (2013.01); G06F 13/4027 (2013.01); G06F 13/4068 (2013.01); G06F 15/7807 (2013.01); G06F 15/7825 (2013.01); H04L 1/004 (2013.01); H04L 45/02 (2013.01); H04L 45/22 (2013.01); H04L 45/42 (2013.01); H04L 45/745 (2013.01); H04L 69/324 (2013.01); G06F 13/4208 (2013.01); G06F 13/4282 (2013.01)] 19 Claims
OG exemplary drawing
 
1. An interconnect interface, comprising:
a first transmitter and a first receiver; and
an electrical physical layer, coupled between the first transmitter and the first receiver;
wherein:
the first transmitter is coupled to a first device, and the first receiver is coupled to a second device;
data provided by the first device is transmitted by the first transmitter, transferred through the electrical physical layer, received by the first receiver;
the first transmitter includes an arbiter for arbitrating between a plurality of channels of the first device to obtain the data from the first device;
the first transmitter includes a packet generator, which packs the data obtained from the first device into packets to be transferred through the electrical physical layer;
the first transmitter further includes a first buffer that backs up the data obtained from the first device for retransmission;
the interconnect interface is a socket-to-socket interconnect interface or a die-to-die interconnect interface; and
the interconnect interface further comprises a second transmitter and a second receiver coupled at two ends of the electrical physical layer; and
the second transmitter is coupled to the second device and the second receiver is coupled to the first device, and the interconnect interface forms a full-duplex structure.