US 11,852,696 B2
Magnetic sensor assembly
Ignatius Josephus Van Dommelen, Nijmegen (NL)
Assigned to Sencio B.V., Nijmegen (NL)
Appl. No. 17/798,094
Filed by Sencio B.V., Nijmegen (NL)
PCT Filed Feb. 11, 2021, PCT No. PCT/NL2021/050089
§ 371(c)(1), (2) Date Aug. 8, 2022,
PCT Pub. No. WO2021/162550, PCT Pub. Date Aug. 19, 2021.
Claims priority of application No. 2024891 (NL), filed on Feb. 13, 2020.
Prior Publication US 2023/0092411 A1, Mar. 23, 2023
Int. Cl. G01R 33/00 (2006.01)
CPC G01R 33/0047 (2013.01) 8 Claims
OG exemplary drawing
 
1. A magnetic sensor assembly comprising a magnetic sensor with a main sensor surface and four side surfaces, and a lead frame having a main lead frame surface, wherein the main lead frame surface corresponds to a major, flat plane of the lead frame,
wherein the magnetic sensor is positioned onto the lead frame with one of the four side surfaces attached to the main lead frame surface, and the main sensor surface is oriented perpendicular to the main lead frame surface,
wherein a magnetic sensor assembly is moulded at least in part around the magnetic sensor and lead frame and forming package body thereof,
wherein the magnetic sensor comprises a first plurality of contact pads, the lead frame comprises a second plurality of external bond pads, the first plurality of contact pads are connected to a subgroup of the second plurality of external bond pads by a conductive glue,
wherein the second plurality of external bond pads are extending away from the package body,
wherein the main lead frame surface comprises a magnetic sensor attachment area providing space for positioning the one of the four side surfaces of the magnetic sensor, and
further comprising an extending rim on the main lead frame surface defining in part the magnetic attachment area; wherein a non-conductive layer is provided between the magnetic sensor attachment area and the one of the four side surfaces, and wherein the non-conductive layer is delimited by the extending rim.