CPC G01R 31/318511 (2013.01) [G01R 31/31718 (2013.01); H01L 22/12 (2013.01)] | 20 Claims |
1. A method of identifying defects in an electronic assembly, comprising, by a processing unit:
obtaining a grid of nodes representative of a location of electronic units of an electronic assembly, wherein each node is representative of an electronic unit and is neighboured by at most eight other nodes,
wherein a first plurality of nodes represents failed electronic units according to at least one test criterion, and a second plurality of nodes represents passing electronic units according to the least one test criterion,
based on the grid, determining for at least one first node of the first plurality of nodes, at least one first straight line which:
is oriented along a direction on the grid out of four possible directions,
includes the first node and nodes of at least the first plurality of nodes, and
matches a first criterion,
based on the grid, determining for at least one second node of the first plurality of nodes, at least one second straight line which:
is oriented along a direction on the grid out of four possible directions,
includes the second node and nodes of at least the first plurality of nodes, and
matches the first criterion,
wherein if the first straight line and the second straight line match a second criterion, determining a third line which fits at least part of the first line and at least part of the second line according to a fitting criterion, thereby identifying, based on this third line, a subset of nodes, and
wherein if at least one node from the subset of nodes belongs to the second plurality of nodes, concluding that an electronic unit represented by the at least one node on the grid is a failed electronic unit, thereby facilitating identification of a failed electronic unit of the electronic assembly.
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