US 11,852,620 B2
System and method for evaluating a bond
Morteza Safai, Newcastle, WA (US)
Assigned to THE BOEING COMPANY, Arlington, VA (US)
Filed by The Boeing Company, Chicago, IL (US)
Filed on Oct. 18, 2021, as Appl. No. 17/451,290.
Application 17/451,290 is a continuation of application No. 16/670,857, filed on Oct. 31, 2019, granted, now 11,181,518.
Prior Publication US 2022/0034861 A1, Feb. 3, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. G01N 33/207 (2019.01); G01N 29/04 (2006.01); H05H 1/24 (2006.01)
CPC G01N 33/207 (2019.01) [G01N 29/043 (2013.01); H05H 1/2406 (2013.01); G01N 2291/267 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A system for evaluating a bond, comprising:
a first electrode;
a second electrode spaced apart from the first electrode;
a sacrificial material layer positioned proximate to a surface of a bonded structure that includes the bond; and
a power source configured to cause the first and second electrodes to generate an electrical arc that at least partially ablates the sacrificial material layer as part of a non-destructive inspection of the bond, wherein a first wave is generated in response to the ablation of the sacrificial material layer, and wherein the first wave reflects off of the bond as a second wave.