US 11,852,550 B2
Combined temperature and pressure sensing device with improved eletronics protection
Palani Thanigachalam, Karnataka (IN); Vijayakumar S, Karnataka (IN); and Nirmala HJ, Karnataka (IN)
Assigned to Honeywell International Inc., Charlotte, NC (US)
Filed by Honeywell International Inc., Charlotte, NC (US)
Filed on Jan. 26, 2023, as Appl. No. 18/160,227.
Application 18/160,227 is a continuation of application No. 17/248,660, filed on Feb. 2, 2021, granted, now 11,592,349.
Prior Publication US 2023/0168140 A1, Jun. 1, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. G01L 19/00 (2006.01); G01K 7/16 (2006.01); G01L 9/00 (2006.01)
CPC G01L 19/0092 (2013.01) [G01K 7/16 (2013.01); G01L 9/0035 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An apparatus for sensing pressure and temperature comprising:
a media isolation chamber assembly comprising a sleeve member and a bellows member, wherein the bellows member is disposed in the sleeve member;
a first circuit board element;
a pressure sensing element disposed in the bellows member and electrically coupled to the first circuit board element; and
a temperature sensing element disposed in the sleeve member and electrically coupled to the first circuit board element.