US 11,852,510 B2
Sensor and method for manufacturing the same
Shinichi Tomooka, Saitama (JP); and Yasushi Sakai, Saitama (JP)
Assigned to SEKISUI POLYMATECH CO., LTD., Saitama (JP)
Appl. No. 17/414,417
Filed by SEKISUI POLYMATECH CO., LTD., Saitama (JP)
PCT Filed Dec. 23, 2019, PCT No. PCT/JP2019/050275
§ 371(c)(1), (2) Date Jun. 16, 2021,
PCT Pub. No. WO2020/137938, PCT Pub. Date Jul. 2, 2020.
Claims priority of application No. 2018-248431 (JP), filed on Dec. 28, 2018.
Prior Publication US 2022/0090944 A1, Mar. 24, 2022
Int. Cl. G01D 5/24 (2006.01); G06F 3/044 (2006.01); G06F 3/041 (2006.01); G01R 27/26 (2006.01)
CPC G01D 5/24 (2013.01) [G06F 3/0445 (2019.05); G01R 27/2605 (2013.01); G06F 3/0446 (2019.05); G06F 3/04164 (2019.05)] 17 Claims
OG exemplary drawing
 
1. A sensor comprising:
a base member; and
a sensor sheet,
wherein the sensor sheet includes
a sensor main body that includes at least one sensor electrode,
a tail portion that includes a wiring line electrically connected to the at least one sensor electrode and that projects and extends with respect to the base member,
wherein the base member includes a joint surface portion that is fixed to the sensor main body, and
wherein the sensor further comprises a separation portion that is defined between the base member and the sensor sheet, and a part of the sensor sheet at the separation portion is not fixed to the base member.