US 11,852,470 B2
Inspecting device
Chih-Chieh Liao, Hsinchu (TW); Yu-Min Sun, Hsinchu (TW); and Chih-Feng Cheng, Hsinchu (TW)
Assigned to Global Unichip Corporation, Hsinchu (TW); and Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Global Unichip Corporation, Hsinchu (TW); and Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Dec. 13, 2020, as Appl. No. 17/120,253.
Claims priority of application No. 109137550 (TW), filed on Oct. 29, 2020.
Prior Publication US 2022/0136816 A1, May 5, 2022
Int. Cl. G01B 5/20 (2006.01); G01N 21/88 (2006.01); G01R 31/00 (2006.01)
CPC G01B 5/204 (2013.01) [G01N 21/88 (2013.01); G01R 31/00 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An inspecting device, comprising:
a carrier with a through hole and a ground pad corresponding to the through hole, wherein the carrier comprises a first surface and a second surface opposite to the first surface, the through hole penetrates from the first surface to the second surface, and the ground pad is disposed on the second surface;
a plurality of telescopic probes disposed in parallel on the first surface of the carrier;
a locking component passing through the through hole, wherein the locking component comprises a screw, a head of the screw comprises a first pitch and a second pitch, and a density of the first pitch is different from a density of the second pitch; and
a conductive structure partially embedded in the locking component, wherein the conductive structure, the locking component, and the ground pad are electrically connected.