	US 11,851,747 B2
	Potassium sodium niobate sputtering target and production method thereof
Ryosuke Sakashita, Ibaraki (JP); Hiroshi Takamura, Ibaraki (JP); Atsushi Nara, Ibaraki (JP); and Ryo Suzuki, Tokyo (JP)
Assigned to JX METALS CORPORATION, Tokyo (JP)
Appl. No. 16/956,056
Filed by JX Metals Corporation, Tokyo (JP)
PCT Filed Feb. 15, 2019, PCT No. PCT/JP2019/005478 § 371(c)(1), (2) Date Jun. 19, 2020, PCT Pub. No. WO2019/167657, PCT Pub. Date Sep. 6, 2019.
Claims priority of application No. 2018-036786 (JP), filed on Mar. 1, 2018.
Prior Publication US 2020/0370168 A1, Nov. 26, 2020
Int. Cl. C23C 14/34 (2006.01); C01G 33/00 (2006.01); H01J 37/34 (2006.01); C04B 35/495 (2006.01)

CPC C23C 14/3414 (2013.01) [C01G 33/006 (2013.01); C04B 35/495 (2013.01); H01J 37/3426 (2013.01); C01P 2002/60 (2013.01); C01P 2006/10 (2013.01); C01P 2006/40 (2013.01); C01P 2006/90 (2013.01)]

6 Claims

1. A potassium sodium niobate sputtering target, comprising a relative density is 95% or higher, a volume resistivity is less than 1000 Ωcm, a variation of maximum value/minimum value in the volume resistivity is less than 1.5, and a content ratio of potassium, sodium and niobium is Nb:K:Na=1.0:X:1-X, wherein X is 0.3≥X, in terms of atomic ratio.