US 11,851,540 B2
Laminated film, and composition for preparing same
Boreum Jeong, Sejong-si (KR); Chanjae Ahn, Suwon-si (KR); Hye Young Kong, Uijeongbu-si (KR); Sun Jin Song, Seoul (KR); A Ra Jo, Suwon-si (KR); and Kyeong-sik Ju, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Gyeonggi-Do (KR); and SAMSUNG SDI CO., LTD., Gyeonggi-Do (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR); and SAMSUNG SDI CO., LTD., Yongin-si (KR)
Filed on Jul. 30, 2020, as Appl. No. 16/943,166.
Claims priority of application No. 10-2019-0092733 (KR), filed on Jul. 30, 2019.
Prior Publication US 2021/0032420 A1, Feb. 4, 2021
Int. Cl. B32B 27/08 (2006.01); B32B 27/34 (2006.01); B32B 27/28 (2006.01); B32B 7/023 (2019.01); C08J 5/18 (2006.01)
CPC C08J 5/18 (2013.01) [B32B 7/023 (2019.01); B32B 27/08 (2013.01); B32B 27/281 (2013.01); B32B 27/34 (2013.01); B32B 2250/02 (2013.01); B32B 2250/24 (2013.01); B32B 2255/10 (2013.01); B32B 2270/00 (2013.01); B32B 2307/418 (2013.01); C08J 2379/08 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A laminated film comprising a first layer, and a second layer laminated to at least one surface of the first layer,
the first layer comprising a poly(amide-imide) copolymer having a weight average molecular weight of about 50,000 grams/mole to about 100,000 grams/mole, and
the second layer comprising a poly(amide-imide) copolymer, polyimide, or a combination thereof having a weight average molecular weight of about 10,000 grams/mole to about 45,000 grams/mole, wherein an amide content of the poly(amide-imide) copolymer included in the second layer is less than or equal to about 30 mol % based on a total number of moles of structural units of the poly(amide-imide) copolymer.