US 11,851,530 B2
Material for forming organic film, patterning process, and polymer
Daisuke Kori, Joetsu (JP); Takashi Sawamura, Joetsu (JP); Keisuke Niida, Joetsu (JP); and Seiichiro Tachibana, Joetsu (JP)
Assigned to SHIN-ETSU CHEMICAL CO., LTD., Tokyo (JP)
Filed by SHIN-ETSU CHEMICAL CO., LTD., Tokyo (JP)
Filed on Jan. 26, 2021, as Appl. No. 17/158,735.
Claims priority of application No. 2020-026190 (JP), filed on Feb. 19, 2020.
Prior Publication US 2021/0269597 A1, Sep. 2, 2021
Int. Cl. C08G 73/10 (2006.01); C08J 5/18 (2006.01); G03F 7/09 (2006.01); G03F 7/075 (2006.01); G03F 7/16 (2006.01); C08J 5/08 (2006.01)
CPC C08G 73/1046 (2013.01) [C08G 73/1067 (2013.01); C08J 5/08 (2013.01); G03F 7/0755 (2013.01); G03F 7/091 (2013.01); G03F 7/094 (2013.01); G03F 7/161 (2013.01); C08J 2379/08 (2013.01)] 21 Claims
 
1. A material for forming an organic film, the material comprising:
an organic solvent; and
a polymer having a structure shown by the following general formula (1A) as a partial structure:

OG Complex Work Unit Chemistry
wherein in the general formula (1A):
R1 represents a hydrogen atom or a monovalent organic group having 1 to 10 carbon atoms,
n1 represents an integer of 0 or 1,
n2 and n3 satisfy:
0≤n2≤6,
0≤n3≤6, and
1≤n2+n3≤6,
W1 represents a tetravalent organic group and is shown by any of the following formulae (1D):

OG Complex Work Unit Chemistry
wherein an aromatic ring in the formula (1D) optionally has a substituent thereon, and
W2 is shown by the following formula (1E):
W2═—CH2—  (1E).