US 11,851,322 B2
Microelectromechanical system (MEMS) sensor packages and methods for producing microelectromechanical system sensor packages having a plurality of MEMS sensor chips
Rainer Markus Schaller, Saal a.d. Donau (DE); and Jochen Dangelmaier, Beratzhausen (DE)
Assigned to Infineon Technologies AG, Neubiberg (DE)
Filed by Infineon Technologies AG, Neubiberg (DE)
Filed on Mar. 16, 2021, as Appl. No. 17/249,853.
Claims priority of application No. 102020108775.6 (DE), filed on Mar. 30, 2020.
Prior Publication US 2021/0300749 A1, Sep. 30, 2021
Int. Cl. B81B 7/00 (2006.01); G01L 9/08 (2006.01); B81C 1/00 (2006.01)
CPC B81B 7/007 (2013.01) [B81C 1/00301 (2013.01); G01L 9/08 (2013.01); B81B 2201/0264 (2013.01); B81B 2203/0127 (2013.01); B81B 2207/012 (2013.01); B81B 2207/095 (2013.01); B81C 2203/0154 (2013.01); B81C 2203/0792 (2013.01)] 22 Claims
OG exemplary drawing
 
1. A sensor package, comprising:
a microelectromechanical systems (MEMS) sensor chip;
a cover arranged over a first main surface of the MEMS sensor chip, the cover being fabricated from a mold compound;
an electrical through contact extending through the cover and configured to electrically couple the sensor package to a circuit board arranged over the cover; and
a logic chip arranged between the MEMS sensor chip and the cover, wherein the logic chip is configured to logically process measurement signals provided by the MEMS sensor chip.