US 11,850,911 B2
Mounting structure of thermal management module for vehicle
Yeonho Kim, Seoul (KR); Gee Young Shin, Suwon-si (KR); Jae Yeon Kim, Hwaseong-si (KR); Jeawan Kim, Hwaseong-si (KR); Jung Sam Gu, Daejeon (KR); Jae Chun Ryu, Daejeon (KR); and Sung-Wook Park, Daejeon (KR)
Assigned to HYUNDAI MOTOR COMPANY, Seoul (KR); KIA CORPORATION, Seoul (KR); and HANON SYSTEMS, Daejeon (KR)
Filed by HYUNDAI MOTOR COMPANY, Seoul (KR); Kia Corporation, Seoul (KR); and HANON SYSTEMS, Daejeon (KR)
Filed on Apr. 21, 2022, as Appl. No. 17/725,859.
Claims priority of application No. 10-2021-0117444 (KR), filed on Sep. 3, 2021.
Prior Publication US 2023/0072182 A1, Mar. 9, 2023
Int. Cl. B60H 1/00 (2006.01); B60H 1/32 (2006.01)
CPC B60H 1/00535 (2013.01) [B60H 1/32331 (2019.05)] 9 Claims
OG exemplary drawing
 
1. A mounting structure of a thermal management module for a vehicle, the mounting structure comprising:
a mounting carrier mounted at a front of a vehicle body and having a receiving space; and
the thermal management module mounted in the receiving space;
wherein the thermal management module includes:
an air conditioner mounted in the receiving space and configured to adjust a temperature of a vehicle interior according to a cooling mode or a heating mode; and
a cooling device mounted in the receiving space and configured to heat-exchange with a working fluid using an external air introduced from outside of the cooling device,
wherein an air guider is provided between the air conditioner and the cooling device and configured for guiding an external air introduced from the outside of the air guider to the air conditioner and the cooling device,
wherein an evaporator is provided inside the air conditioner,
wherein at least one discharge hole is formed in the air conditioner toward the cooling device at a position corresponding to the evaporator,
wherein at least one penetration hole is formed in the air guider at a position corresponding to the at least one discharge hole, and
wherein the at least one penetration hole is configured to supply a condensed water of the evaporator discharged from the at least one discharge hole to the cooling device.