US 11,850,702 B2
Chemical mechanical planarization membrane
Cheng-Ping Chen, Taichung (TW); Ren-Dou Lee, Hsinchu (TW); Sheng-Tai Peng, Miaoli County (TW); Tsung-Lung Lai, Hsinchu (TW); Tzi-Yi Shieh, Hsinchu (TW); and Chien-Wei Chang, Taoyuan (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu (TW)
Filed on Mar. 3, 2022, as Appl. No. 17/685,760.
Application 17/685,760 is a continuation of application No. 15/994,088, filed on May 31, 2018, granted, now 11,267,099.
Claims priority of provisional application 62/563,701, filed on Sep. 27, 2017.
Prior Publication US 2022/0184773 A1, Jun. 16, 2022
Int. Cl. B24B 37/32 (2012.01); B24B 37/015 (2012.01); B24B 37/20 (2012.01); H01L 21/321 (2006.01)
CPC B24B 37/32 (2013.01) [B24B 37/015 (2013.01); B24B 37/20 (2013.01); H01L 21/3212 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A chemical mechanical planarization (CMP) tool, comprising:
a carrier;
a malleable membrane coupled to the carrier and having a lower surface facing away from the carrier, wherein the lower surface of the malleable membrane comprises a first malleable material within a central region of the lower surface and a second malleable material within a peripheral region of the lower surface, which surrounds the central region; and
wherein the first malleable material of the lower surface provides the central region of the lower surface with a first stiffness and the second malleable material of the lower surface provides the peripheral region of the lower surface with a second stiffness that is different than the first stiffness.