US 11,850,685 B2
Solder material
Hirohiko Watanabe, Hachioji (JP); Shunsuke Saito, Hachioji (JP); and Yoshihiro Kodaira, GuangDong (CN)
Assigned to FUJI ELECTRIC CO., LTD., Kawasaki (JP)
Filed by FUJI ELECTRIC CO., LTD., Kawasaki (JP)
Filed on Mar. 1, 2019, as Appl. No. 16/290,401.
Application 16/290,401 is a continuation of application No. PCT/JP2018/009760, filed on Mar. 13, 2018.
Claims priority of application No. 2017-053177 (JP), filed on Mar. 17, 2017.
Prior Publication US 2019/0193210 A1, Jun. 27, 2019
This patent is subject to a terminal disclaimer.
Int. Cl. B23K 35/02 (2006.01); C22C 13/02 (2006.01); B23K 35/26 (2006.01); B23K 1/20 (2006.01); B23K 1/00 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01); H05K 3/34 (2006.01); B23K 101/42 (2006.01); B23K 35/362 (2006.01)
CPC B23K 35/0222 (2013.01) [B23K 1/0016 (2013.01); B23K 1/203 (2013.01); B23K 35/025 (2013.01); B23K 35/0244 (2013.01); B23K 35/26 (2013.01); B23K 35/262 (2013.01); C22C 13/02 (2013.01); H01L 21/4853 (2013.01); H01L 24/00 (2013.01); H01L 24/29 (2013.01); H01L 24/48 (2013.01); B23K 35/362 (2013.01); B23K 2101/42 (2018.08); H01L 24/32 (2013.01); H01L 24/45 (2013.01); H01L 24/73 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/29211 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48472 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83447 (2013.01); H01L 2224/83455 (2013.01); H01L 2924/014 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15747 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19107 (2013.01); H01L 2924/3511 (2013.01); H05K 3/3463 (2013.01)] 5 Claims
OG exemplary drawing
 
1. A solder material consisting of:
not less than 6.0% by mass and not more than 8.0% by mass Sb;
not less than 3.0% by mass and not more than 5.0% by mass Ag;
not less than 0.05% by mass and not more than 0.3% by mass Ni;
Sn; and
incidental impurities,
wherein
when the incidental impurities include Cu, the Cu is present as no more than one of the incidental impurities such that the solder material is essentially free of Cu.