US 11,850,672 B2
Method of using processing oven
Lei Jing, Santa Clara, CA (US); M Ziaul Karim, San Jose, CA (US); Kenneth Sautter, Sunnyvale, CA (US); and Kang Song, San Jose, CA (US)
Assigned to YIELD ENGINEERING SYSTEMS, INC., Freemont (CA)
Filed by Yield Engineering Systems, Inc., Fremont, CA (US)
Filed on Jul. 25, 2022, as Appl. No. 17/872,320.
Application 17/872,320 is a continuation of application No. 17/692,760, filed on Mar. 11, 2022, granted, now 11,465,225.
Application 17/692,760 is a continuation in part of application No. 17/463,012, filed on Aug. 31, 2021, granted, now 11,296,049, issued on Apr. 5, 2022.
Prior Publication US 2023/0060603 A1, Mar. 2, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. B23K 1/015 (2006.01); B23K 1/008 (2006.01); B23K 3/08 (2006.01); H01L 23/00 (2006.01); B23K 101/42 (2006.01); B23K 101/40 (2006.01); B23K 1/012 (2006.01); H01L 21/60 (2006.01); B23K 1/00 (2006.01)
CPC B23K 1/015 (2013.01) [B23K 1/008 (2013.01); B23K 3/085 (2013.01); H01L 24/742 (2013.01); H01L 24/75 (2013.01); B23K 1/0016 (2013.01); B23K 1/012 (2013.01); B23K 2101/40 (2018.08); B23K 2101/42 (2018.08); H01L 2021/60007 (2013.01); H01L 2021/6027 (2013.01); H01L 2021/60135 (2013.01); H01L 2224/75272 (2013.01); H01L 2224/75283 (2013.01)] 20 Claims
OG exemplary drawing
 
19. A method of using a processing oven, comprising:
supporting at least one substrate on a rotatable spindle of the processing oven;
rotating the rotatable spindle supporting the at least one substrate;
reducing an oxygen concentration in the processing oven to below about 750 ppm;
heating a top surface of the at least one substrate using a lamp assembly of the processing oven, wherein the lamp assembly includes a plurality of spaced-apart lamps disposed above the at least one substrate;
after the heating, admitting a chemical vapor into the processing oven above the at least one substrate while directing an inert gas into the processing oven below the at least one substrate;
removing at least a portion of the chemical vapor from the processing oven;
after the removing, further heating the at least one substrate to a second temperature higher than the first temperature using the lamp assembly; and
after the further heating, cooling the at least one substrate.