US 11,850,635 B2
Apparatus for processing substrate
Dong Hee Son, Gyeonggi-do (KR); and Ki Young Kwak, Gyeonggi-do (KR)
Assigned to Semes Co., Ltd., Chungcheongnam-do (KR)
Filed by SEMES Co., Ltd., Chungcheongnam-do (KR)
Filed on Aug. 16, 2021, as Appl. No. 17/402,882.
Claims priority of application No. 10-2020-0137239 (KR), filed on Oct. 22, 2020.
Prior Publication US 2022/0126330 A1, Apr. 28, 2022
Int. Cl. B08B 3/08 (2006.01); B08B 3/04 (2006.01)
CPC B08B 3/041 (2013.01) [B08B 3/08 (2013.01)] 18 Claims
OG exemplary drawing
 
1. An apparatus for processing a substrate comprising:
a support unit that supports a substrate and is rotatable;
a first nozzle for discharging a first rinse solution to a first area of the substrate;
a second nozzle for discharging a second rinse solution to a second area of the substrate different from the first area; and
a control unit for controlling the first nozzle and the second nozzle,
wherein the control unit controls the first nozzle to discharge the first rinse solution to a first area during a first period so that the first area and the second area of the substrate are wetted by the first rinse solution, and some area of the substrate is not wetted by the first rinse solution,
wherein the control unit controls the first nozzle to discharge the first rinse solution to the first area and the second nozzle to discharge the second rinse solution to the second area in a second period directly connected to the first period so that an entire upper surface of the substrate is wetted by the first rinse solution and the second rinse solution, and
wherein the second period includes a section, in which a rotation speed of the substrate is a constant speed.