US 11,850,327 B2
Flexible hexagonal boron nitride composites for additive manufacturing applications
Linda M. Guiney, Chicago, IL (US); Nikhita D. Mansukhani, Libertyville, IL (US); Adam E. Jakus, Chicago, IL (US); Ramille N. Shah, Hinsdale, IL (US); and Mark C. Hersam, Wilmette, IL (US)
Assigned to Northwestern University, Evanston, IL (US)
Appl. No. 17/049,281
Filed by Northwestern University, Evanston, IL (US)
PCT Filed Apr. 30, 2019, PCT No. PCT/US2019/029902
§ 371(c)(1), (2) Date Oct. 20, 2020,
PCT Pub. No. WO2019/213071, PCT Pub. Date Nov. 7, 2019.
Claims priority of provisional application 62/664,733, filed on Apr. 30, 2018.
Prior Publication US 2021/0038770 A1, Feb. 11, 2021
Int. Cl. A61F 2/28 (2006.01); A61L 27/44 (2006.01); B33Y 80/00 (2015.01); A61N 1/375 (2006.01); B33Y 70/10 (2020.01); A61L 27/50 (2006.01); A61M 5/142 (2006.01); C08K 3/38 (2006.01); D01F 1/10 (2006.01); D01F 6/62 (2006.01); D01F 6/84 (2006.01); D01F 6/92 (2006.01)
CPC A61L 27/446 (2013.01) [A61L 27/50 (2013.01); A61M 5/14276 (2013.01); A61N 1/37512 (2017.08); B33Y 70/10 (2020.01); B33Y 80/00 (2014.12); C08K 3/38 (2013.01); D01F 1/10 (2013.01); D01F 6/625 (2013.01); D01F 6/84 (2013.01); D01F 6/92 (2013.01); A61M 2205/3633 (2013.01); C08K 2003/385 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A biocompatible device comprising:
an implantable electronic device; and
a thermally conductive, electrically insulating scaffold around at least a portion of the implantable electronic device, the scaffold comprising continuous flexible fibers of a cytocompatible composite, the cytocompatible composite comprising:
a biocompatible elastomeric polymer binder; and
hexagonal boron nitride particles dispersed in the biocompatible elastomeric polymer binder.