US 12,506,118 B2
Perpendicular semiconductor device assemblies and associated methods
Brandon P. Wirz, Boise, ID (US); Andrew M. Bayless, Boise, ID (US); Owen R. Fay, Meridian, ID (US); and Bang-Ning Hsu, Taichung (TW)
Assigned to Micron Technology, Inc., Boise, ID (US)
Filed by Micron Technology, Inc., Boise, ID (US)
Filed on Aug. 17, 2022, as Appl. No. 17/889,914.
Prior Publication US 2024/0063184 A1, Feb. 22, 2024
Int. Cl. H01L 25/065 (2023.01); H01L 25/00 (2006.01)
CPC H01L 25/0657 (2013.01) [H01L 25/50 (2013.01); H01L 2225/06531 (2013.01); H01L 2225/06534 (2013.01); H01L 2225/06551 (2013.01); H01L 2225/06586 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor device assembly, comprising:
an assembly semiconductor die having a top surface, with a first and a second assembly communication element at the top surface; and
a semiconductor die stack coupled to the assembly semiconductor die at the top surface, the semiconductor die stack including:
a first and a second semiconductor die, the first and the second semiconductor dies each having a top surface perpendicular to the top surface of the assembly semiconductor die,
wherein the first semiconductor die includes a first die communication element (i) aligned with and (ii) configured to directly communicate with the first assembly communication element, and
wherein the second semiconductor die includes a second die communication element (i) aligned with and (ii) configured to directly communicate with the second assembly communication element.