US 12,499,077 B2
Variable link width in two directions for main band chip module connection
Ravindranath Doddi, Hyderabad (IN); Umamaheshwaran V, Salem (IN); Afreen Haider, Muzaffarpur (IN); Lekhya Pavani Godavarthi, Hyderabad (IN); and Harinatha Reddy Ramireddy, Hyderabad (IN)
Assigned to Qualcomm Incorporated, San Diego, CA (US)
Filed by QUALCOMM Incorporated, San Diego, CA (US)
Filed on Apr. 24, 2023, as Appl. No. 18/306,034.
Prior Publication US 2024/0354279 A1, Oct. 24, 2024
Int. Cl. G06F 15/78 (2006.01); G06F 13/42 (2006.01)
CPC G06F 15/7825 (2013.01) [G06F 13/42 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method comprising:
sending an enable request from a module of a first die to a module partner of a second die through a sideband to operate a main band of a die-to-die connection that connects the first die module to the second die module partner at a specified transmit link width, wherein the specified transmit link width has a specified set of transmit data lines of the main band;
receiving an enable response from the module partner through the sideband to operate the main band at the specified transmit link width;
sending a second enable request including from the module of the first die to the module partner of the second die through the sideband to operate the main band of the die-to-die connection that connects the first die module to the second die module partner at a specified receive link width, wherein the specified receive link width has a specified set of receive data lines of the main band;
receiving a second enable response from the module partner through the sideband to operate the main band at the specified receive link width; and
communicating data with the module partner through the main band using a specified link width in response to receiving the enable response, wherein the specified link width includes the specified transmit link width and the specified receive link width.