US 12,496,680 B2
Polishing pad and method for manufacturing polished product
Teppei Tateno, Ehime (JP); Ryuma Matsuoka, Ehime (JP); Hiroshi Kurihara, Ehime (JP); Satsuki Narushima, Ehime (JP); and Yamato Takamizawa, Ehime (JP)
Assigned to FUJIBO HOLDINGS, INC., Tokyo (JP)
Appl. No. 18/029,073
Filed by FUJIBO HOLDINGS, INC., Tokyo (JP)
PCT Filed Sep. 27, 2021, PCT No. PCT/JP2021/035318
§ 371(c)(1), (2) Date Mar. 28, 2023,
PCT Pub. No. WO2022/071205, PCT Pub. Date Apr. 7, 2022.
Claims priority of application No. 2020-166169 (JP), filed on Sep. 30, 2020.
Prior Publication US 2023/0373055 A1, Nov. 23, 2023
Int. Cl. B24B 37/22 (2012.01); B24B 37/24 (2012.01)
CPC B24B 37/22 (2013.01) [B24B 37/24 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A polishing pad comprising a polishing layer and a cushion layer, wherein
a ratio E′B40/E′C40 of a storage elastic modulus of the polishing pad at 40° C. in dynamic viscoelasticity measurement to the polishing pad performed under a bending mode condition with a dry state, a frequency of 10 rad/s, and 20 to 100° C., E′B40, to a storage elastic modulus of the polishing pad at 40° C. in dynamic viscoelasticity measurement to the polishing pad performed under a compression mode condition with a dry state, a frequency of 10 rad/s, and 20 to 100° C., E′C40, is 3.0 or more and 15.0 or less, and
a loss factor tan δ of the polishing pad in the dynamic viscoelasticity measurement to the polishing pad performed under the bending mode condition is 0.10 or more and 0.30 or less in a range of 40° C. or more and 70° C. or less.