US 12,165,944 B2
Electro-optical package and method of fabrication
Shuhe Li, Pasadena, CA (US); and Gerald Cois Byrd, Shadow Hills, CA (US)
Assigned to Rockley Photonics Limited, Altrincham (GB)
Filed by ROCKLEY PHOTONICS LIMITED, Altrincham (GB)
Filed on Dec. 14, 2021, as Appl. No. 17/550,886.
Claims priority of application No. 2019881 (GB), filed on Dec. 16, 2020.
Prior Publication US 2022/0189841 A1, Jun. 16, 2022
Int. Cl. H01L 23/34 (2006.01); H01L 23/00 (2006.01)
CPC H01L 23/34 (2013.01) [H01L 24/43 (2013.01); H01L 24/44 (2013.01); H01L 2924/14 (2013.01)] 18 Claims
OG exemplary drawing
 
1. An assembly, comprising:
a carrier;
a first integrated circuit, on the carrier;
a first bonding layer, between the carrier and the first integrated circuit;
a thermoelectric cooler, on the carrier;
a second integrated circuit, on the thermoelectric cooler;
a first wire bond, connecting a first pad, on the first integrated circuit, to a second pad, on the second integrated circuit;
a printed circuit board, on the carrier;
a second bonding layer, between the carrier and the printed circuit board; and
a second wire bond, connecting a third pad, on the first integrated circuit, to a fourth pad, on the printed circuit board,
the first pad and the second pad having a height difference less than 100 microns, and
the third pad and the fourth pad having a height difference less than 100 microns.