US 11,844,200 B2
Electromagnetic interference shielding in recesses of electronic modules
Susanne Behl, Hanau (DE); Holger Ulland, Willich (DE); and Alan Paul Stadnik, Hanau (DE)
Assigned to HERAEUS DEUTSCHLAND GMBH & CO. KG, Hanau (DE)
Filed by Heraeus Deutschland GmbH & Co. KG, Hanau (DE)
Filed on Sep. 24, 2020, as Appl. No. 17/031,074.
Claims priority of application No. 19206508 (EP), filed on Oct. 31, 2019.
Prior Publication US 2021/0136963 A1, May 6, 2021
Int. Cl. H05K 9/00 (2006.01); H05K 1/02 (2006.01); H05K 3/30 (2006.01)
CPC H05K 9/0022 (2013.01) [H05K 1/023 (2013.01); H05K 3/30 (2013.01); H05K 9/0084 (2013.01); H05K 2203/1366 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic module comprising:
a substrate defining a substrate plane;
at least two electronic components mounted on the substrate adjacent to each other;
a dielectric material covering the electronic components and defining a recess between the adjacent electronic components with a first surface facing one of the electronic components and a second surface opposite the first surface; and
a conductive layer coating the first surface of the recess and at least a portion of the dielectric material outside the recess, wherein the second surface of the recess is substantially free of the conductive layer, wherein a thickness of the conductive layer in the recess and a thickness of the conductive layer outside the recess do not differ by more than a factor of two, and wherein the first and second surfaces of the recess are oriented at an angle of 90°-5° with respect to the substrate plane.